The main objective of this event is brainstorming about future developments, challenges, and research opportunities about degradation of inorganic materials, used in the microelectronic components. Amongst different inorganic materials, used in microelectronic components and devices, BPA-PC and silicone-based adhesives are widly used. Reliability and lifetime of microelectronic components are largely dependent on the proper functionality of inorganic materials. This meeting will ultimately aim at initiating collaboration between Delft University of Technology (TUD), which has a long history of research on the reliability of microelectronic components, and other interested industries and universities in and outside the Netherlands. Topics like failure mechanisms of degradation of inorganic materials, reliability, and life assessments of microelectronics devices, are of main interests of this meeting.
NWA Matchmaking event – Degradation and reliability of inorganic materials
26 June 2019